Source:Laser Manufacturer News  15th Jul 2024

LASERVALL Group was founded in Hong Kong, China in 2003, with LASERVALL Laser Technology (Shenzhen) Co., Ltd. established in Shenzhen. As a multinational corporation that has been deeply engaged in the field of laser processing automation equipment for 21 years, it is a national-level specialized, sophisticated, distinctive and innovative "Little Giant" enterprise.

As an intelligent solution provider, LASERVALL devotes itself to the intelligent manufacturing field of "Laser + Automation" and explores scenario applications of intelligent manufacturing across various industries. Its product portfolio includes laser welding, precision solder ball welding, precision laser cutting and laser marking equipment. Among these, precision solder ball welding equipment is the company's core product, which is widely applied in the 3C electronic consumer products, automotive electronics and new energy industries.

Recently, Laser Manufacturer News had the honor of conducting an in-depth discussion and exchange with Li Mengmeng, General Manager of LASERVALL Laser Technology (Shenzhen) Co., Ltd., on the company's products, development status and the future development of the laser industry, allowing us to gain a more profound understanding of LASERVALL Laser.

Laser Manufacturer News: Hello, Mr. Li! Thank you very much for accepting our interview with Laser Manufacturer News. First of all, could you please briefly introduce the company's business performance, including its product portfolio, application fields and development status?

Mr. Li: Hello! Thank you very much for the interview. I'm Li Mengmeng, and I currently serve as the General Manager of LASERVALL Laser Technology (Shenzhen) Co., Ltd. I hold a Master's degree in Mechatronic Engineering from Xidian University, and have been engaged in the laser processing industry for more than a decade. I led the team to successfully develop China's first set of fully automated solder ball welding equipment, and have been focusing on the research of precision processing equipment and complete sets of automated solutions all these years.

Founded in Hong Kong, China in 2003, LASERVALL Group has now been deeply engaged in the field of laser processing automation equipment for 21 years. Evolving from an initial equipment supplier, we have become a one-stop solution provider for precision laser processing and automation integrating the entire industrial chain of R&D, design, production, sales and after-sales service.

Globally, LASERVALL Group has established advanced R&D laboratories in South Korea, Singapore, Hong Kong and other regions, and set up local service centers in India, Vietnam and other countries.

Our products fall into four major categories: laser welding, precision solder ball welding, precision laser cutting and laser marking equipment. These products are widely applied in the 3C electronic consumer products, new energy and semiconductor industries. We also own a number of independent patent technologies in precision cutting, laser marking and other fields.

In recent years, the company has made huge investment in R&D, continuously launching new technologies and products. We have cooperated with many well-known universities and research institutions to promote the integration of industry, academia, research and application. The company has maintained a sound development momentum with a steady growth in product sales.

Laser Manufacturer News: In terms of precision laser processing, what outstanding achievements and application cases has LASERVALL made?

Mr. Li: For precision laser processing, LASERVALL has always upheld the business philosophy of "Steady and Pragmatic, Strive for Excellence". We have been deeply cultivating this field and maintaining a leading position in the segmented market –

Leading laser solder ball welding technology: LASERVALL has adopted the original micro air pressure sensing technology to achieve high-speed and high-precision solder ball welding. This technology has increased the ball separation speed by 50% and overall efficiency by 50%, with the solder coverage rate reaching over 90% and yield rate exceeding 99.5%.Our solder ball welding technology has been widely applied in precision components such as VCM, HDD, BGA, MEMS, camera modules and thermal components, especially in the field of high-end 3C electronic consumer products including smartphones, laptops, tablet computers, camera modules, wearable devices, smart home appliances, 5G communication products and sensors.

Adapting to market changes, addressing market pain points and launching automated solutions: LASERVALL not only provides high-performance laser processing equipment, but also is committed to offering comprehensive "Laser + Automation" solutions. For example: for the 3C industry, we have launched the turnkey automated solution for camera module assembly lines and the fully automated production line solution for VCM; for the automotive industry, the automated solution for on-vehicle camera modules; and for the semiconductor industry, the on-line solder ball mounting solution for semiconductor BGA, among others.

An extremely high market share: LASERVALL takes a leading position in the precision solder ball welding field, boasting strong competitiveness in technical strength and market performance. For years, we have been providing supporting solution equipment for major leading manufacturers worldwide, with the market share of our specialized solder ball welding equipment for the high-end camera industry reaching over 90%.

Laser Manufacturer News: In the field of precision laser processing, what outstanding achievements and application cases has LASERVALL made?

Mr. Li: For precision laser processing, LASERVALL has always upheld the business philosophy of "Steady and Pragmatic, Strive for Excellence". We have been deeply cultivating this field and maintaining a leading position in the segmented market –

Leading laser solder ball welding technology: LASERVALL has adopted the proprietary micro air pressure sensing technology to achieve high-speed and high-precision solder ball welding, increasing the ball separation speed by 50% and overall efficiency by 50%, with solder coverage rate reaching over 90% and yield rate exceeding 99.5%.Our solder ball welding technology has been widely applied in precision components such as VCM, HDD, BGA, MEMS, camera modules and thermal components, especially in the field of high-end 3C electronic consumer products including smartphones, laptops, tablet computers, camera modules, wearable devices, smart home appliances, 5G communication products and sensors.

Adapting to market changes, addressing market pain points and launching automated solutions: LASERVALL not only provides high-performance laser processing equipment, but also is committed to offering comprehensive "Laser + Automation" solutions. For example, for the 3C industry, we have launched the turnkey automated solution for camera module assembly lines and the fully automated production line solution for VCM; for the automotive industry, the automated solution for on-vehicle camera modules; and for the semiconductor industry, the on-line solder ball mounting solution for semiconductor BGA, among others.

An extremely high market share: LASERVALL takes a leading position in the precision solder ball welding field, boasting strong competitiveness in technical strength and market performance. For years, we have been providing supporting solution equipment for major leading manufacturers worldwide, with the market share of our specialized solder ball welding equipment for the high-end camera industry reaching over 90%.

Laser Manufacturer News: We noticed that LASERVALL recently showcased the MLS Laser Solder Ball Welding Series and the Low-Temperature metal Welding Series. Are these newly launched products of the company? Could you introduce the features, advantages and industrial applications of each series respectively?

Mr. Li: As China's first supplier capable of providing fully automated solder ball welding solutions to customers in mass production, LASERVALL has been continuously conducting R&D and iteration based on our core processes in recent years, and developed a variety of advanced fully automated equipment and technical solutions. The MLS Laser Solder Ball Welding Series exhibited at the Shanghai Optics and Photonics Expo is the company's core product, integrating multiple functions such as automatic loading and unloading, dispensing, curing, solder ball welding, automatic alignment and AOI. It is compatible with precise solder ball sizes ranging from 50μm to 890μm, featuring fast welding speed, high positioning accuracy and a yield rate of over 99.5%. It can greatly improve production efficiency and save labor costs for customers.

The Low-Temperature metal Welding Series, on the other hand, was launched in recent years specifically for on-vehicle products in the automotive industry. With the rapid development of the new energy vehicle industry, the market demand for on-vehicle components has risen sharply. Moreover, driven by the rapid trend of automotive electrification, the on-vehicle component market has witnessed an almost subversive transformation, and new assembly processes are advancing vigorously. Addressing the pain points and demands of the automotive industry, the company has developed the low-temperature metal welding process, which not only meets customers' low-temperature requirements for metal welding of on-vehicle cameras, but also resolves air tightness issues and enhances product reliability.

Laser Manufacturer News: We understand that precision solder ball welding is the company's core product. What is the current demand for solder ball welding in domestic industries such as automotive electronics and semiconductors?

Mr. Li: In recent years, domestic industries including automotive electronics and semiconductors have maintained a robust development momentum in China, which has also driven the vigorous growth of the laser solder ball welding market.

Rising demand and expanded market space: With the rapid development of industries such as new energy vehicles and 5G communication, the demand for precision solder ball welding in the automotive electronics and semiconductor industries has been on a steady rise, which has brought us a broader market space.

Process upgrading and expanded application scenarios: Automotive electronics and semiconductor products have stringent requirements for precision and reliability, which has driven the upgrading of processing technologies and led to wider application scenarios for precision solder ball welding technology.

As the automotive electronics and semiconductor industries pursue higher production efficiency and product quality, they have put forward more demanding requirements for the automation level and stability of solder ball welding equipment. LASERVALL has successfully developed a variety of automated equipment. Meanwhile, in response to different customers' requirements for solder ball welding processes, we can also provide customized automated solutions according to their specific needs to meet personalized demands.

At present, LASERVALL's solder ball welding equipment has been adopted by many well-known automotive electronics and semiconductor enterprises and has been well recognized by our customers.

Laser Manufacturer News: At present, the laser industry has been facing intense internal competition in China. In your opinion, how can enterprises stand out in such a fiercely competitive market?

Mr. Li: All along, LASERVALL has focused on technological development in the field of laser processing equipment, become the industry leader in segmented sectors, and continuously expanded overseas markets.

In my view, for enterprises to stand out in a fiercely competitive market, efforts need to be made in the following aspects:

Technical Innovation: Enterprises must persist in continuous R&D and innovation, enhance the capability of providing automated solutions, and lay a solid foundation for development with strong technological strength.

Application Expansion and Market Development: Proactively expand the application fields of laser technology and explore new application scenarios; vigorously develop both domestic and international markets, and establish overseas production bases to gain more room for development.

People-oriented and Service-focused: Attach great importance to customer service and nurture strong customer relationships; strengthen talent development to attract and cultivate professional talents.

Laser Manufacturer News: Drawing on the experience of developed countries in Europe and the United States, how do you view the development potential of China's laser welding market?

Mr. Li: China's laser welding market boasts enormous development potential and broad prospects, and laser welding technology will play an important role in driving the transformation and upgrading of China's manufacturing industry.

China is the world's largest manufacturing market, with huge market demand in numerous sectors such as automotive, consumer electronics, and machinery manufacturing, which provides an extensive market space for the development of laser welding technology. Meanwhile, with the continuous advancement of domestic laser technology, the prices of high-end laser devices have been on a steady decline. This is conducive to the application of laser technology in more fields and lays a solid foundation for the expansion of the laser welding market.

Furthermore, at the national level, it has been proposed to lead industrial innovation with scientific and technological innovation and actively foster and develop new quality productive forces. The transformation and upgrading of China's manufacturing industry is an irreversible trend. In the future, the requirements for precision processing and automation will continue to rise, and laser welding, as an advanced processing technology, will play an increasingly pivotal role in this process. China's laser welding market will also inject robust impetus into the development of new quality productive forces and the advancement of high-quality development.