Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by launching PIC International, a global conference dedicated to this industry. 

Attendees at the inaugural PIC International conference will hear industry-leading insiders delivering more than 30 presentations spanning six sectors.

PIC International provides comprehensive coverage of all aspects of this industry, from basic research to materials, equipment, packaging, and the incorporation of chips in data centres and optical networks. So whether you focus on system integration, developing and manufacturing components, financing this sector, or providing the materials and equipment needed to support this industry, PIC International is your must-attend conference for 2016.​

Six key themes

• wher should the laser go?
• Driving deployment of PICs in datacentres
• Increasing the capability of optical networks
• What's the role of the foundry?
• Do we have the tools for designing, making, packaging and testing PICs?
• A question of material: InP, silicon, or something else?

Presentations 2016 (committed to date)

wher should the laser go?

• High speed photonic integrated receivers for 100G and above
  William Ring, CEO and President - BB Photonics
• Heterogeneous integration: creating photonic circuits for advanced systems-in-package
  Gregory Fish, CTO - Aurrion
• Excelling in the efficiency of lasers formed on silicon
  Shinji Matsuo - NTT Photonics Lab
• Title TBC
  Fang Wu, CTO - ArtIC Photonics
• Turning to quantum dot lasers for terabit communication?
  Hamid Arabzadeh, Chairman, President and CEO – Ranovus

Driving deployment of PICs in datacentres

• Using CMOS photonics to support next-generation cloud computing, data center and high performance computing connectivity
  Arlon Martin, Senior Director, Marketing - Mellanox Technologies
• Constructing very large scale PICs for data centres
  Di Liang, Research Scientist - HP
• Towards cost-effective 100 Gb/s optical transceivers
  Jason Orcutt, Research Staff Member – IBM
• Creating the building blocks for better datacentres                                                                   Craig Thompson, Director of Strategic Marketing - Finisar

Increasing the capability of optical networks

• How can silicon photonics benefit optical access deployment? An example from the FABULOUS EU Project
  Silvio Abrate, Head of Applied Photonics - ISMB
• Photonic circuits enabling multi-dimensional IM/DD systems for short reach optical interconnects
  David Plant, Professor in the Department of Electrical and Computer Engineering – McGill University
• Silicon photonics in optical networking – yesterday's hype, today's reality, tomorrow's vision
  Harald Bock, CTO Technology Strategy- Coriant

What’s the role of the foundry?

• LioniX: Aid the growth of photonics with the TriPleX integrated optics platform
  René Heideman, CTO and Co-founder - LioniX
• Accelerating photonic ASICs development
  KatarzynaŁawniczuk, JePPIX Coordinator - JePPIX
• Can foundries underpin the success of the PIC?
  Samuel Wang, VP, Optoelectronics - Global Communication Semiconductors
• Title TBC
  Luc Augustin, CTO - Smart Photonics
• Imec’s flexible, state-of-the-art 50Gb/s silicon photonics platform overview                        Philippe Absil, PT Unit, 3D and Optical Technologies Department Director - IMEC

Do we have the tools for designing, making, packaging and testing PICs?

• Bringing first-time-right design to silicon photonics
  Sean Anderson, Hardware Engineer - Silicon Photonics - CISCO
• Taking a close, damage-free look at the channels on a silicon photonics chip
  Stefano Grillanda, Postdoctoral Researcher - Politecnico di Milano
• Overview of the current status of photonic and electronic design tools and flows
  TwanKorthorst, CEO - PhoeniX Software

A question of material: InP, silicon, or something else?

• Surveying silicon photonics: Identifying strengths and weaknesses
  Thomas Collins, Chief Technology Officer, Co-founder at Caliopa, Huawei
• InP and silicon: a strong combination for integration of photonics and electronics
  Meint Smit, Professor of Photonic Integration - TU Eindhoven
• Selecting materials for PIC production
  Ronald Broeke, General Manager - Bright Photonics
• A bright future for germanium-on-insulator wafers?
  Vincent Reboud , Research Engineer  - CEA-Leti
• Hybrid and heterogeneous PICs for high performance applications
• Martijn Heck, Associate Professor - Aarhus University
• Title TBC
  Martin Guy, CTO & Strategic Marketing, TeraXion

Click here to view the full agenda

The venue for this two day conference is the Sheraton Brussels Airport Hotel, in Belgium on 1^st-2^nd March 2016.

Further information is available on the PIC International website at: www.picinternational.net or by calling +44 (0)24 7671 8970.

For logos, images and further details on this release please contact Adam Richardson at adam.richardson@angelbc.com